Minimum Outer Line Width

.004"

.0039" - .002"

Minimum Inner Line Width

.004"

.0039" - .002"

Minimum Outer Space, Trace/Trace

.004"

.0039" - .002"

Minimum Inner Space, Trace/Trace

.004"

.0039" - .002"

Minimum Outer Space, Trace/Pad

.004"

.0039" - .002"

Minimum Inner Space, Trace/Pad

.004"

.0039" - .002"

Minimum Space, PCB Edge to Conductor

.010"

.0099" - .008"

Layer-to-Layer Registration

+/-.005"

+/- .003"

Maximum Finished PCB Thickness

.094" - .125"

.126" - .250"

Minimum Board Thickness Tolerance

+/-10%

+/- 8%

Dimensions - Hole Location

+/- .003"

+/- .003"

Dimensions - Fab O.D.

+/- .005"

+/- .004"

Fabrication Radius

+/- 5 deg.

+/- 5 deg.

Warpage (inch per inch) (flatness of finished board)

.007"

.0069" - .005"

Minimum Dielectric Thickness

.0039" - .002"

.0019" - .0015"

Maximum Number of Layers

26

34

Minimum Plated Hole Size * (Finished)

.008"

.006"

Tolerance - Plated Hole Size

+/- .003"

+/- .002"

Minimum Inner Layer Pad

+ .015" over FHS

+ .014" over FHS

Mech. Min. Drill Hole Size

.010"

.006"

Laser Min. Drill Hole Size

.006"

.0059" - .002"

Normal Finished Hole Size

.008"

.004"

Plane Relief Diameter

.030" over FHS

.025" over FHS

Minimum Outer Layer Pad

+ .015" over FHS

+ .014" over FHS

Min. Outer Non-Plated Hole to Metal

.008"

.0079" - .007"

Min. Inner Non-Plated Hole to Metal

.008"

.0079" - .007"

Max. Number holes/sq. in. (average over board)

200

300

Max. Number holes/sq. in. (localized density)

400-625 (BGA)

625-1000 (BGA, MCM-L)

Construction

2+2

3+3

Drill Size

.006

.004"

Aspect Ratio

.5:1

.75:1

Capture Pad

12

8

SMT Minimum Pad (edge to edge) with Rib (web)

.010"

.008"

Minimum covered copper feature to clearance

.003"

.0025"

Minimum Soldermask Rib (web)

.004"

.003"

Minimum Clearance over pad

pad +.006"

pad +.005"

HASL Minimum Thickness

.0005"

.0003

HASL Maximum Thickness

.001"

.0015"

HASL Co-Plan

+/- 1000 u in.

+/- 500 u in.

Selective Solder Strip Minimum Thickness

.0007"

.00025"

Selective Solder Strip Maximum Thickness

.00075"

.001"

Selective Solder Strip Co-Plan

+/- 250 u in.

+/- 100 u in.

Electrolytic Nickel Thickness

200 u in.

call for info.

Electroless Nickel Thickness

200 u in.

call for info.

Electrolytic Hard Gold Maximum Thickness

50 u in.

call for info.

Electrolytic Soft Gold Maximum Thickness

30 u in.

call for info.

Electroless Gold Maximum Thickness

30 u in.

100 u in.

Immersion Gold Thickness

2-5 u in.

N/A

Immersion Silver Thickness

3-4 u in.

N/A

Immersion Tin Thickness

30-50 u in.

N/A

OSP (Cu 56, Cu 106A)

Co-Planarity = Copper Plate

N/A

FR4 Standard Multifunctional

135

FR4 High Tg

170-180

Getek

170

Polyimide

235

BT

180

Cyanate Ester

250

Nelco 4000-13

210

Rogers 4003

> 280

Rogers 4350

> 280

Rogers RO 3003

call for information

Duroid 5870

call for information

Taconic 6000+RF35

call for information

Ohmega Ply

(ohms/sq : 25, 50, 100, 250)

Maximum cu weight planes

5 oz

Maximum cu weight signals

3 oz

Minimum cu weight

1/4 oz

Maximum cu weight

5 oz

Minimum cu weight

1/8 oz

Material types used: Tetra-functional, high grade Multi-functional Tetra II, FR-4, Getek, Polyimide, BT, Cyanate Ester, Gore (Speed board C), noflow Pyralux (cavity brds), Nelco 13, Allied 408, Pyralux Rogers 4403, All Arlons, Rogers, and Taconics.

Glass types used: 1060, 1080, 2313, 7628, 2116, 2113

Minimum conductor width: .002"

Minimum feature spacing: .003"

Minimum core thickness:.002"

Minimum dielectric:.002"

Impedance stack-up design and verification service

Buried and blind vias

Sequential lamination construction

Buried capacitance

Finished impedance tolerance of +/- 10% (28 ohms technology)

Buried resistor (Ohmega) tolerance of +/- 10%

Single ply construction

• Maximum number of layers: 34

• Maximum board thickness: .300"

• Panel thickness tolerances

• Bow and twist: Assuming normal manufacturing tolerance, the typical deviation from flatness will be .007 in./in. worst case subject to the design and dielectric stackup.

• Liquid dielectric buildup for HDI products when requested

Minimum Mechanical drilled hole size:.006"

Minimum Laser drilled hole size:.002"

Maximum drilled hole size:.265"

Minimum slot width size:.020"

Minimum distance, edge to edge, from plated hole to internal circuitry: .008"

Minimum distance, edge to edge, from non-plated hole to circuitry: .007" internal / .007" external

Minimum signal pad must be larger than drilled hole diameter: .014" internal / .014" external

Minimum plane clearance (relief) must be larger than nominal finished hole: .025"

Tighter annular ring is possible with teardrops or by reducing finished annular ring requirements.

Controlled depth drill available- consult HDI section for aspect ratios or contact PPC engineering.

Plasma desmear + etchback in house

Maximum Hole Aspect Ratio: 15:1

(SMOBC) Soldermask over bare copper, HASL

SMOBC with OSP, Enthone Cu56, Cu106a

Electroless Nickel, Immersion gold, selective or full body

Electroless Nickel, Electroless gold full body

Electrolytic gold, selective or full body (hard & soft)

Multiple surface plating available

Per IPC-SM-840

Wet types: SR1000, SR1001

Photo-imageable types: (LPI) Taiyo PSR-4000, Dynachem Epic, Probimer 5, Dexter Hysol 8200, Lea Ronal, Coates clear

Dry Film types: Dupont Vacrel, 8000 series

Soldermask colors: Red, Green, Blue, Black, Clear, Purple

Minimum clearance pad edge to clearance edge: LPI - .002", Dry Film - .003", Wet Mask - .006"

Legend colors: White, Yellow, Black, Red, Orange

Via fill: Taiyo PSE 4000 BN + PSR 4000MP, Hysol IC, Macu via fill, Epic, Coates

Via plug & via cap: Hysol SR1000 + Hysol SR1020

Tolerance on overall dimensions: +/- .005"

Minimum inside radius: .015"

Scoring, In-board Beveling, Beveling

Countersinking, Counter-boring, Edge Milling

Planar resistor (Ohmega)- to within 1%

CAD net-list testing D356A (Multiple CAD formats accepted)

Electrical test parameters compliant with IPC and Bellcore specifications

Probe testing down to .004" (features to .0015")

Probe test available for wirebond, flip chip & other technologies

Standard test parameters: isolation- 10 meg ohms, continuity- 20 ohms, test to IPC class 1, 2, 3

Impedance measurements (documentation available if requested)

Impedance coupons serialized to each board

Impedance measurements of specific traces

Single ended and differential impedances

Custom impedance coupons generated per customer requirement. Contact PPC engineering.

Standard and thermal stress cross-section evaluation (IPC-6012)

Layer construction verification

SEC testing

UL Approval Fourth Quarter 2001

Bellcore SIR compliant (not certified)

ISO-9002 certification (2nd Quarter 2002)

Integrated IPQC (In Process Quality Control) and OQC (Outgoing Quality Control) systems

IPC-A-600, IPC-6012 / IPC-R-700 trained personnel

Control charts and Cpk analysis on critical processes

Unless otherwise specified, all boards will meet requirements of IPC-A-600F CLASS 1

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